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IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2027 – Osaka, Japan | Aristo Vanguard

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IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2027

Dates: May 1, 2028
Location: Intex Osaka, 1-5-102 Nanko-Kita, Suminoe-ku Osaka, 559-0034 Japan +81 (0)6 6612 8800, Japan
Industry: Electronic Design & Components

Electronic Design & Components
Semiconductor Manufacturing
Electronics Packaging

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About the Exhibition

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

Date: May 1, 2028
Location: Osaka, Japan
Venue: Intex Osaka, 1-5-102 Nanko-Kita, Suminoe-ku Osaka, 559-0034 Japan +81 (0)6 6612 8800
Industries: Electronic Design & Components
Frequency: once a year

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RX Japan

Website:eventseye.com

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