Aristo Vanguard
IC PACKAGING FAIR 2026
- Dates
- October 27 – 29, 2026
- Location
- Shenzhen World Exhibition & Convention Center, No.1 Zhancheng Road Fuhai Street Bao’an District Shenzhen, Guangdong, China
- Industry
- Electronic Design & Components
- Electronic Design & Components
- Semiconductor Packaging
- Electronics Manufacturing
About the Exhibition
IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...
- Date
- October 27 – 29, 2026
- Location
- Shenzhen, China
- Venue
- Shenzhen World Exhibition & Convention Center, No.1 Zhancheng Road Fuhai Street Bao’an District Shenzhen, Guangdong
- Industries
- Electronic Design & Components
- Frequency
- once a year
Organizer
RX China
Website:eventseye.com
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Target Audience
This exhibition is designed for:
- Trade Public
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