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IC PACKAGING FAIR 2026 – Shenzhen, China | Aristo Vanguard

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IC PACKAGING FAIR 2026

Dates: October 1, 2027
Location: Shenzhen World Exhibition & Convention Center, No.1 Zhancheng Road Fuhai Street Bao’an District Shenzhen, Guangdong, China
Industry: Electronic Design & Components

Electronic Design & Components
Electronics Manufacturing
Semiconductor Packaging

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About the Exhibition

IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...

Date: October 1, 2027
Location: Shenzhen, China
Venue: Shenzhen World Exhibition & Convention Center, No.1 Zhancheng Road Fuhai Street Bao’an District Shenzhen, Guangdong
Industries: Electronic Design & Components
Frequency: once a year

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RX China

Website:eventseye.com

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