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Shenzhen International Semiconductor Technology and Application Expo (SEMI-e) 2026 - Expolume Expo Venues Organizers Articles Search CTRL+K Home Expos Menu Menu Home Events Avenues Exhibitors Event Organizers My Attending My Bookmarks Articles Sign in Shenzhen International Semiconductor Technology and Application Expo (SEMI-e) 2026 Date: Sep 9, 2026 – Sep 11, 2026 # Electronic Components & Materials # Electronics & Electrical Engineering # Integrated Circuits (ICs) # Semiconductors > China > Guangdong > Shenzhen Follow 0 Save post Share post Attend/Exhibit Welcome Enter details Log in Forgot password? Recover account Don't have an account? Sign up Password recovery Your email Reset password Go back Confirm code Email confirmation code Please type the recovery code which was sent to your email Confirm Didn't receive anything? Send again New password Set password Password must contain at least 8 characters and one number. 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Complete profile Do it later Official Website 8th Shenzhen International Semiconductor Technology and Application Expo (SEMI-e) will be held from 9-11 September 2026 at Shenzhen World Exhibition and Convention Center. Covering chip design, semiconductor equipment, advanced packaging, materials, and AI computing, the event will gather 900+ exhibitors, attract 50,000+ visitors, and span 60,000 sqm. Organized by the CIOE Organizing Committee, the expo highlights innovation across the entire semiconductor supply chain. Running concurrently with the China International Optoelectronic Expo, it enables synergy between photonics and semiconductors, aiming to foster cross-sector collaboration and promote downstream market growth. Range of Exhibition Semiconductor Equipment: Thermal annealing furnaces, etching machines, ion implanters, film deposition equipment, lithography machines, dicing saws, wire bonders, die bonders, grinding machines, inspection/test instruments, failure analysis tools, laser equipment, contamination control systems, and cleaning systems. Semiconductor Materials: Silicon wafers, compound semiconductors, CMP pads, photo masks, sputtering targets, etching liquids, bonding wires, substrates, photoresists, ultra-pure water, specialty gases, and high-performance plastics. Advanced Packaging: Flip-chip, wafer-level, 2.5D/3D, bump, fan-out packaging, related materials, design, testing, and manufacturing equipment. Chip and IC Design: IC design, EDA tools, storage chips, CPUs, analog/digital chips, DSPs, power management ICs, RF and driver ICs, and sensors. AI Computing: AI chips, computing servers, power systems, liquid cooling, and AI-related data infrastructure. Semiconductor Core Components: Robotics, sensors, precision parts, valves, RF components, quartz parts, gauges, pumps, stepper motors, filters, ceramic elements, electrostatic chucks, and motion control units. Wide Bandgap Semiconductors & Power Devices: SiC, GaN, Ga₂O₃, diamond, AlN, power devices (MOSFET, IGBT, HEMT), microwave RF components (MMIC), optoelectronic components (LED, LD, photodetectors), and substrates. Target Audience Semiconductor engineers, IC designers, electronics R&D teams, procurement professionals, manufacturing managers, investors, supply chain professionals, packaging/testing experts, academic researchers, government and association representatives. Exhibitors 900+ Area 60000 sqm Audience 50000+ Access Free Access, Pre Registeration Required Event Type International Exhibtion Language Chinese, English Avenue Shenzhen World Exhibition and Convention Center Baoan Address No. 1, Zhancheng Road, Fuhai Street, Baoan District, Shenzhen, China 深圳市宝安区福海街道和平社区展城路1号 google Previous Editions Shenzhen International Semiconductor Technology and Application Expo (SEMI-e) 2025 [Sep 10-Sep 12, 2025 at Shenzhen World Exhibition and Convention Center Baoan] Shenzhen International Semiconductor Technology and Application Expo (SEMI-e) 2026 [Sep 9-Sep 11, 2026 at Shenzhen World Exhibition and Convention Center Baoan] Organizer Shenzhen Zhongxin Materials Exhibition Co., Ltd. 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