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شروع پرسشنامهHangzhou Global AI Computing Power and Data Center Liquid Cooling Industry Expo (GACL) 2027 - Expolume Expo Venues Organizers Articles Search ⌘+K Home Expos Menu Menu Home Events Avenues Exhibitors Event Organizers My Attending My Bookmarks Articles Sign in Hangzhou Global AI Computing Power and Data Center Liquid Cooling Industry Expo (GACL) 2027 Date: Feb 26, 2027 – Feb 28, 2027 # Cloud & Digital Infrastructure # Digital Technology > China > Hangzhou > Zhejiang Follow 0 Save post Share post Attend/Exhibit Welcome Enter details Log in Forgot password? Recover account Don't have an account? Sign up Password recovery Your email Reset password Go back Confirm code Email confirmation code Please type the recovery code which was sent to your email Confirm Didn't receive anything? Send again New password Set password Password must contain at least 8 characters and one number. 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Complete profile Do it later Official Website The Hangzhou Global AI Computing Power and Data Center Liquid Cooling Industry Expo (GACL) is held on February 26–28, 2027 at Hangzhou International Expo Center in Hangzhou, China. Organized by Hangzhou Huajie Exhibition Co., Ltd., the event covers liquid-cooled computing equipment, thermal-management systems, cooling components and fluids, data center infrastructure, monitoring software, engineering services, and extended liquid-cooling applications. The event features more than 500 projected exhibitors, more than 30,000 projected professional visitors, and more than 60,000 sqm of exhibition space. The exhibition enables data center operators, computing infrastructure buyers, equipment manufacturers, engineering contractors, and distributors to source systems, compare technologies, identify suppliers, establish partnerships, and discuss procurement requirements. Range of Exhibition Liquid-Cooled Computing Equipment: cold-plate, immersion and spray-cooled servers, AI computing systems, liquid-cooled storage, network equipment, cabinets, rack-scale clusters, modular micro-data centers, containerized computing pods, edge-computing equipment, air-to-liquid cooling conversion systems. Cooling Distribution and Heat Exchange: coolant distribution units, cold-plate systems, immersion tanks, spray-cooling systems, fluid distribution modules, heat exchangers, dry coolers, cooling towers, chillers, waste-heat recovery systems, energy-storage heat exchange, data center liquid-cooling systems. Components and Fluid Distribution: high- and low-efficiency cold plates, liquid-cooling pumps, control-valve assemblies, filters, flow meters, pressure sensors, temperature sensors, leak sensors, blind-mate quick connectors, sealed fittings, piping systems, insulation and corrosion-protection components. Coolants and Thermal Materials: fluorinated fluids, dielectric coolants, single-phase and two-phase cooling fluids, deionized water, coolant-regeneration consumables, thermal gels, thermal pads, graphene films, phase-change materials, liquid metals, sealing materials, corrosion-resistant materials, thermally conductive structural materials. Monitoring, Testing and Maintenance: liquid-cooling DCIM systems, three-dimensional operations software, energy scheduling systems, CFD thermal-simulation software, energy-efficiency testing, airtightness testing, cleanliness testing, pipe-cleaning equipment, coolant-regeneration equipment, intelligent inspection systems. Green Data Center Infrastructure: power-distribution equipment, UPS systems, precision distribution cabinets, intelligent PDUs, energy-storage systems, hot- and cold-aisle containment, fire protection, security systems, noise control, structured cabling, indirect evaporative cooling, fresh-air energy conservation, carbon management, PUE optimization. Engineering and Computing Services: AI computing centers, supercomputing centers, IDC facilities, edge data centers, EPC contracting, data center planning, system integration, engineering construction, computing park operations, cloud services, computing-capacity leasing, testing and certification. Extended Liquid-Cooling Applications: energy-storage batteries, high-power charging systems, power electronics, industrial equipment, semiconductor packaging, rail-transit thermal control. Target Audience Cloud service providers, internet companies, AI model developers, data center operators, telecommunications operators, AI computing center investors, server manufacturers, data center EPC contractors, liquid-cooling equipment distributors, institutional technology procurement departments. Exhibitors 500+ Area 60000 sqm Audience 8000+ Access Free Access, Pre Registeration Required Event Type Conference, International Exhibtion Cycle Annually Language Chinese, English Avenue Hangzhou International Expo Center Address No. 353, Benjing Avenue, Qianjiang Century City, Xiaoshan District, Hangzhou City, Zhejiang Province, China 杭州市萧山区钱江世纪城奔竞大道353号 google bing Amap Previous Editions Hangzhou Global Data Center Liquid Cooling Expo and AI Computing Power Conference (GDCE 2027) [Mar 1-Mar 3, 2027 at Hangzhou Grand Convention and Exhibition Center] Hangzhou Global AI Computing Power and Data Center Liquid Cooling Industry Expo (GACL) 2027 [Feb 26-Feb 28, 2027 at Hangzhou International Expo Center] Organizer Hangzhou Huajie Exhibition Co., Ltd. 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Hangzhou Huajie Exhibition Co., Ltd.
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