Aristo Vanguard
ADHESION & BONDING EXPO - OSAKA 2027
- Dates
- May 1, 2028
- Location
- Intex Osaka, 1-5-102 Nanko-Kita, Suminoe-ku Osaka, 559-0034 Japan +81 (0)6 6612 8800, Japan
- Industry
- Adhesion
- Trade fairs
- Adhesion technologies
- Joining technologies
- Industrial manufacturing
About the Exhibition
International Trade Fair for Adhesive & Joining Technologies. "Adhesion & Bonding Expo" is the leading industrial adhesion expo that gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, diffusion...
- Date
- May 1, 2028
- Location
- Osaka, Japan
- Venue
- Intex Osaka, 1-5-102 Nanko-Kita, Suminoe-ku Osaka, 559-0034 Japan +81 (0)6 6612 8800
- Industries
- Adhesion, Paints & Coating Technologies
- Frequency
- once a year
Organizer
RX Japan
Website:eventseye.com
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Target Audience
This exhibition is designed for:
- Trade Public
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