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ADHESION & BONDING EXPO - OSAKA 2027 – Osaka, Japan | Aristo Vanguard

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ADHESION & BONDING EXPO - OSAKA 2027

Dates: May 1, 2028
Location: Intex Osaka, 1-5-102 Nanko-Kita, Suminoe-ku Osaka, 559-0034 Japan +81 (0)6 6612 8800, Japan
Industry: Adhesion

Trade fairs
Adhesion technologies
Joining technologies
Industrial manufacturing

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About the Exhibition

International Trade Fair for Adhesive & Joining Technologies. "Adhesion & Bonding Expo" is the leading industrial adhesion expo that gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, diffusion...

Date: May 1, 2028
Location: Osaka, Japan
Venue: Intex Osaka, 1-5-102 Nanko-Kita, Suminoe-ku Osaka, 559-0034 Japan +81 (0)6 6612 8800
Industries: Adhesion, Paints & Coating Technologies
Frequency: once a year

Organizer

RX Japan

Website:eventseye.com

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