Beijing AI Computing Power and Liquid Cooling Technology Expo (AACE) 2026

Beijing AI Computing Power and Liquid Cooling Technology Expo (AACE) 2026 - Expolume Expo Venues Organizers Articles Search ⌘+K Home Expos Menu Menu Home Events Avenues Exhibitors Event Organizers My Attending My Bookmarks Articles Sign in Beijing AI Computing Power and Liquid Cooling Technology Expo (AACE) 2026 Date: Nov 12, 2026 – Nov 14, 2026 # AI & Intelligent Systems # Cloud & Digital Infrastructure # Digital Technology # Humanoid & Service Robots # Low-Altitude Economy & Advanced Air Mobility (AAM) # Robotics & Autonomous Systems # Unmanned Systems & Drones > Beijing > China Follow 1 Save post Share post Attend/Exhibit Welcome Enter details Log in Forgot password? Recover account Don't have an account? Sign up Password recovery Your email Reset password Go back Confirm code Email confirmation code Please type the recovery code which was sent to your email Confirm Didn't receive anything? 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Complete profile Do it later Official Website Beijing AI Computing Power and Liquid Cooling Technology Expo (AACE) is held on November 12–14, 2026 at Beiren Etrong International Exhibition & Convention Center in Beijing, China. Organized by Sels Exhibition Co., Ltd., the event covers AI computing infrastructure, liquid cooling, AI chips and accelerators, intelligent computing servers, data centers, computing networks, edge computing, AI algorithms and intelligent terminals. The event features 200+ core exhibitors, 18,000+ paid visitors, and 25,000+ sqm of exhibition space. The exhibition enables data center operators, infrastructure buyers, AI hardware companies and technology providers to source equipment, compare computing and cooling technologies, identify suppliers and establish commercial partnerships across the AI computing infrastructure supply chain. Range of Exhibition AI Computing Chips & Acceleration Hardware: AI computing chips, AI accelerator cards, GPUs, DPUs, NPUs, ASIC custom chips, compute-in-memory chips. Intelligent Computing Servers & Data Centers: intelligent computing servers, modular data centers, data cloud boxes, data center solutions, batteries, energy storage systems, data center air-conditioning, fresh-air systems, UPS systems, security systems, structured cabling, green data centers, data center maintenance. Computing Networks & Data Infrastructure: computing networks, intelligent computing scheduling systems, AI training datasets, data services, endpoint AI security, privacy computing. Computing Scheduling & Edge Computing: computing resource scheduling, edge computing technologies and associated infrastructure. Endpoint AI Devices: AI PCs, AI smartphones, AI glasses, AI wearable devices, AI home devices, smart bracelets, smart watches. Artificial Intelligence Systems: neural-network chips, intelligent sensors, intelligent PID systems, controllers, expert controllers, neural-network controllers, hybrid and integrated intelligent control systems, hierarchical control systems, artificial neural-network control systems, fuzzy control. AI Models & Algorithms: large AI models, AI algorithms, AI training and inference technologies. Robotics: humanoid robots, domestic robots, food-service robots, reception robots, children’s robots, bionic robots, brain-inspired robots, educational robots, medical robots, cleaning robots, sensing robots, interactive robots, autonomous robots. Low-Altitude Economy: eVTOL aircraft, helicopters, UAVs, fixed-wing aircraft, aircraft components, propulsion systems, structural components, cameras, sensors, navigation systems, flight-control systems. Unmanned & Intelligent Vehicles: unmanned delivery vehicles, cleaning vehicles, disinfection vehicles, security vehicles, emergency-response vehicles, agricultural and forestry vehicles, port vehicles, mining trucks, autonomous vehicles, intelligent logistics vehicles, new-energy vehicles. Advanced Computing & Manufacturing Technologies: future computing, AI and automation, robot vision, intelligent speech recognition, intelligent manufacturing, digital twins, smart factories, advanced materials, nanomaterials, 3D printing, biomanufacturing. Target Audience Data Center Operators, AI Infrastructure Procurement Directors, Cloud Computing Providers, Computing Center Operators, AI Hardware Manufacturers, Server Manufacturers, Semiconductor and AI Chip Companies, Data Center Engineering Firms, Liquid Cooling Solution Providers, Enterprise IT Infrastructure Buyers. Exhibitors 200+ Area 25000 sqm Audience 18000+ Access Pre Registeration Required Event Type International Exhibtion Cycle Annually Language Chinese, English Avenue Beiren Yichuang International Convention and Exhibition Center Address No. 6, Rongchang East Street, Yizhuang, Daxing District, Beijing, China 北京市大兴区亦庄荣昌东街6号 google Previous Editions Beijing AI Computing Power and Liquid Cooling Technology Expo (AACE) 2026 [Nov 12-Nov 14, 2026 at Beiren Yichuang International Convention and Exhibition Center] Organizer Saiyi Brand Management Co., Ltd. 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