China Semiconductor Equipment, Core Components and Materials Expo (CSEAC) 2027

China Semiconductor Equipment, Core Components and Materials Expo (CSEAC) 2027 - Expolume Expo Venues Organizers Articles Search ⌘+K Home Expos Menu Menu Home Events Avenues Exhibitors Event Organizers My Attending My Bookmarks Articles Sign in China Semiconductor Equipment, Core Components and Materials Expo (CSEAC) 2027 Date: Sep 1, 2027 – Sep 3, 2027 # Electronic Components & Materials # Electronic Materials # Electronics & Electrical Engineering # Passive Components # Semiconductors > China > Jiangsu > Suzhou Follow 0 Save post Share post Attend/Exhibit Welcome Enter details Log in Forgot password? Recover account Don't have an account? Sign up Password recovery Your email Reset password Go back Confirm code Email confirmation code Please type the recovery code which was sent to your email Confirm Didn't receive anything? Send again New password Set password Password must contain at least 8 characters and one number. 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Complete profile Do it later Visit Registration Official Website 15th Semiconductor Equipment, Core Components and Materials Expo (CSEAC) will be held from 1-3 September 2027 at Suzhou International Expo Center. The exhibition will showcase semiconductor manufacturing equipment, core components, advanced materials, and intelligent manufacturing solutions. With participation from leading exhibitors and thousands of professional visitors, the event spans a large exhibition area and is organized by top industry bodies. Visitors attend to explore new technologies, expand business networks, and capture emerging opportunities in the semiconductor supply chain. Range of Exhibition Semiconductor Manufacturing Equipment: Wafer fabrication equipment, lithography machines, etching systems, cleaning systems, ion implantation, testing and measurement devices. Core Components: Precision optics, vacuum components, power modules, sensors, pumps, valves, robotics systems. Materials: Silicon wafers, photoresists, specialty gases, electronic chemicals, packaging materials, advanced substrates. Packaging & Testing: Assembly equipment, testing instruments, reliability solutions, failure analysis tools. Intelligent Manufacturing Solutions: Automation systems, smart factory solutions, industrial software, data management platforms. Target Audience Semiconductor manufacturers, wafer fabrication plants, packaging and testing companies, equipment suppliers, materials providers, R&D institutes, academic researchers, electronic component manufacturers, investors, government and industry associations. Exhibitors 1130+ Area 50000 sqm Audience 20000+ Access Pre Registeration Required Event Type Conference, International Exhibtion Cycle Annually Language Chinese, English Avenue Suzhou International Expo Center Address No. 688, Suzhou Avenue East, Suzhou Industrial Park, Suzhou City, Jiangsu Province, China 江苏省苏州市苏州工业园区苏州大道东688号 google Previous Editions China Semiconductor Equipment, Core Components and Materials Expo (CSEAC) 2026 [Aug 31-Sep 2, 2026 at Wuxi Taihu International Expo Center] China Semiconductor Equipment, Core Components and Materials Expo (CSEAC) 2027 [Sep 1-Sep 3, 2027 at Suzhou International Expo Center] Organizer Shanghai Xidanchenxu Semiconductor Technology Co., Ltd. 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