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Start the questionnaireShanghai International Semiconductor Expo 2027 - Expolume Expo Venues Organizers Articles Search ⌘+K Home Expos Menu Menu Home Events Avenues Exhibitors Event Organizers My Attending My Bookmarks Articles Sign in Shanghai International Semiconductor Expo 2027 Date: Jul 1, 2027 – Jul 3, 2027 # Electronic Components & Materials # Electronic Test & Measurement # Electronics & Electrical Engineering # Electronics Manufacturing & Production # Semiconductors > China > Shanghai Follow 0 Save post Share post Attend/Exhibit Welcome Enter details Log in Forgot password? Recover account Don't have an account? Sign up Password recovery Your email Reset password Go back Confirm code Email confirmation code Please type the recovery code which was sent to your email Confirm Didn't receive anything? Send again New password Set password Password must contain at least 8 characters and one number. 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Complete profile Do it later Visit Registration Official Website Shanghai International Semiconductor Expo, held from 1-3 July 2027 at the Shanghai New International Expo Centre, focuses on semiconductor manufacturing, integrated circuits, materials, and third-generation semiconductor technologies. Covering an exhibition area of over 60,000 sqm, it gathers more than 1,200 exhibitors and 60,000 visitors from across the semiconductor industry. Organized by the China Semiconductor Industry Association and Shanghai Electronic Semiconductor Industry Alliance, the event features the entire semiconductor supply chain—from IC design, wafer fabrication, and packaging to SiC and GaN power devices. The exhibition aims to foster industry collaboration, accelerate technological innovation, and promote the integration of production, research, and application in China’s semiconductor ecosystem. Range of Exhibition Semiconductor Equipment: Packaging, diffusion, welding, cleaning, testing, cooling, oxidation, polishing, lithography, etching, ion implantation, CVD/PVD systems, wafer thinning, slicing, dicing, bonding, reflow soldering, automation, robotics, machine vision, precision instruments, cleanroom systems, and water treatment equipment. IC Design: Chip and electronic product design, IC testing and instruments, design tools, manufacturing and packaging, EDA software, IP design, embedded systems, digital and analog circuit design, and fabless solutions. Wafer Fabrication & Packaging: Wafer production, advanced SiP packaging, OSAT, EMS/OEM, silicon wafers, IC substrates, PCB boards, testing and assembly equipment, and packaging design materials. Integrated Circuit Manufacturing: Foundries, wafer fabs, analog and digital IC production, mixed-signal ICs, terminal circuit manufacturing, and system integration. Packaging & Testing Solutions: Probers, probe cards, testers, bonding wires, lead frames, encapsulation materials, adhesives, lamination substrates, automation testing, and precision laser cutting. Third-Generation Semiconductors: SiC and GaN substrates and devices, wafer fabrication, testing, optoelectronic components (LEDs, lasers, detectors), power electronics (MOSFETs, IGBTs, HEMTs), and RF/microwave devices. Semiconductor Materials: Silicon wafers, germanium-silicon materials, SOI materials, quartz and graphite products, photoresists, photomasks, CMP materials, electronic gases, solder materials, adhesives, ceramic substrates, encapsulation materials, and polishing films. Electronic Components: Resistors, capacitors, transistors, connectors, sensors, PCBs, inductors, power supplies, passive components, displays, diodes, relays, transformers, and materials for 5G, IoT, and automotive electronics. Target Audience Semiconductor manufacturers, chip designers, equipment suppliers, material providers, R&D institutions, electronics manufacturers, automotive electronics enterprises, energy technology companies, IoT developers, government & investment agencies. Exhibitors 1000+ Area 60000 sqm Audience 60000+ Access Free Access, Pre Registeration Required Event Type International Exhibtion Cycle Annually Language Chinese, English Avenue Shanghai New International Expo Center Address No. 2345, Longyang Road, Pudong New Area, Shanghai, China 中国上海市浦东新区龙阳路2345号 google bing Amap Previous Editions Shanghai International Semiconductor Expo 2026 [Jun 3-Jun 5, 2026 at Shanghai New International Expo Center] Shanghai International Semiconductor Expo 2027 [Jul 1-Jul 3, 2027 at Shanghai New International Expo Center] Organizer Shanghai Zhongzhan Shixin Exhibition Group Shanghai Intex Exhibition Co., Ltd. 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