Aristo Vanguard
IC & SENSOR PACKAGING EXPO
- Dates
- February 17 – 19, 2027
- Location
- Tokyo Big Sight, Japan
- Industry
- Semiconductors
- Semiconductors
- Electronics manufacturing
- Technology exhibitions
About the Exhibition
IC & SENSOR PACKAGING EXPO is an event focused on integrated circuits, sensors, and packaging technology, scheduled for 17–19 February 2027 at Tokyo Big Sight in Tokyo, Japan.
- Date
- February 17 – 19, 2027
- Location
- Tokyo, Japan
- Venue
- Tokyo Big Sight
- Industries
- Semiconductors, Electronics manufacturing, Technology exhibitions
Organizer
RX
Website:rxglobal.com
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