Germany International Bonding Technology Trade Fair Bondexpo 2026

Germany International Bonding Technology Trade Fair Bondexpo 2026 - Expolume Expo Venues Organizers Articles Search CTRL+K Home Expos Menu Sign in Germany International Bonding Technology Trade Fair Bondexpo 2026 Date: Oct 6, 2026 – Oct 8, 2026 # Adhesives & Sealants # Industrial Automation & Robotics # Manufacturing & Industrial Engineering # Materials, Metals & Resources > Germany > Stuttgart Follow 0 Attend/Exhibit Welcome Enter details Log in Forgot password? Recover account Don't have an account? Sign up Visit Registration Official Website 18th Germany International Bonding Technology Trade Fair Bondexpo (6–8 October 2026) at Messe Stuttgart focuses on the joining and bonding process chain including adhesive bonding, potting, sealing, and foaming, offering system solutions for current and future bonding challenges across multiple materials. The event hosts 500 exhibitors and attracts around 20,000 visitors. Organized by P.E. Schall GmbH & Co. KG, it supports visitors in finding solutions for resource conservation, material mix/hybrid designs, lightweight construction, and miniaturization for microsystem technology. Range of Exhibition Digital & Process Technologies: Digital technologies, AI, maintenance tools, cybersecurity. Assembly & Production Systems: Assembly systems, assembly planning, material feeding, handling, robotics. Joining & Machining: Assembly, joining, and machining technologies. Quality & Inspection: Measuring, testing, inspection, and quality assurance. Automation & Visual Systems: Automation, image processing, sensor technology, analysis tools/software. Production Support & Packaging: Production peripherals, packaging, and related equipment. Industry Services & Education: Associations, specialist communication, education and training, and service providers. Target Audience Production engineers, process engineers, R&D managers, quality assurance specialists, procurement professionals, manufacturing executives, system integrators, material scientists, automation specialists, technical consultants. Exhibitors 500+ Audience 20000+ Access Paid Ticket, Pre Registeration Required Event Type International Exhibtion Language English, German Avenue Messe Stuttgart Address Messe Stuttgart, Messepiazza, Echterdingen, Leinfelden-Echterdingen, Landkreis Esslingen, Baden-Württemberg, 70629, Germany google Previous Editions Germany International Bonding Technology Trade Fair Bondexpo 2026 [Oct 6-Oct 8, 2026 at Messe Stuttgart] Organizer P.E. Schall GmbH & Co. KG Related Events China Adhesives and Sealants Expo 2026 Sep 15, 2026 To Sep 17, 2026 Shanghai New International Expo Center China International Adhesive Tape and Film Expo 2026 Sep 15, 2026 To Sep 17, 2026 Shanghai New International Expo Center Motek Stuttgart International Automation in Production and Assembly Trade Fair Oct 6, 2026 To Oct 8, 2026 Messe Stuttgart Shenzhen International Film and Tape Expo 2026 Oct 27, 2026 To Oct 29, 2026 Shenzhen Convention and Exhibition Center Adhesives and Bonding Expo Europe 2026 Nov 10, 2026 To Nov 12, 2026 Messe Stuttgart European Coatings Show ECS 2027 Apr 27, 2027 To Apr 29, 2027 Nuremburg Messe Osaka Adhesion and Bonding Expo 2027 May 12, 2027 To May 14, 2027 INTEX Osaka Shanghai International Adhesive Tape and Film Expo and Die-cutting Expo 2027 Jun 22, 2027 To Jun 24, 2027 Shanghai National Exhibition and Convention Center There are no results matching your search Load more Global directory of trade fairs, expos and exhibitions. Explore Expo Venues Organizers Company About Articles Contact © 2026 ExpoLume. All rights reserved. Back to top